JIAN YA NA 110V IC SMD BGA Chip Pick Up Tools Pump Vacuum Suction Pen Placement Machine

Specification: Suction can be adjusted Every unit comes with two pens. Both of them can be used at the same time for two workers to share on the assemble line. One can be unplugged for back up. Vacuum pressure adjustable Easy operation. Block the hole with a finger on the pen to pick up a component, open the hole to release the component. Voltage: 110V Weight: 1.5Kg Package Included: 1 x Pump Vacuum Suction Pen Placement Machine 2 x Vacuum Suction Pen 2 x Needles (1.6mm) 2 x Sucker （0.3mm,10mm）

• A machine for two simultaneous operation and single patch speed in the 2 seconds 1PCS range, the unique static noise design makes the machine work quietly. (Such as BGA, QPF and other large IC can be used to operate the suction cup, with your fingers to block the use of a large number of components, such as BGA, QPF and other large ICs can be used to hold the SMD components.
• There is a hole in the pen suck, put the finger after the release of the release), because we put the machine's suction range strictly control the viscosity of the solder paste, the machine's suction size adjustable knob, so do not worry SMD components sucked up to the solder paste printed on the paste after the phenomenon was sucked back.
• Suction can be adjusted
• Every unit comes with two pens. Both of them can be used at the same time for two workers to share on the assemble line. One can be unplugged for back up
• Easy operation. Block the hole with a finger on the pen to pick up a component, open the hole to release the component.